![Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling | Semantic Scholar Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/98ebbb7ff06d45bc6f8bed1ed24351f510b74a22/2-Figure1-1.png)
Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling | Semantic Scholar
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Figure 2 from Copper clip package for high performance MOSFETs and its optimization | Semantic Scholar
![Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging - ScienceDirect Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging - ScienceDirect](https://ars.els-cdn.com/content/image/1-s2.0-S0026271422002128-gr1.jpg)
Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging - ScienceDirect
![a) Cu wire bonds on an IGBT [9], (b) a DCB substrate with Al ribbons... | Download Scientific Diagram a) Cu wire bonds on an IGBT [9], (b) a DCB substrate with Al ribbons... | Download Scientific Diagram](https://www.researchgate.net/publication/289706872/figure/fig1/AS:319869900869632@1453274335320/a-Cu-wire-bonds-on-an-IGBT-9-b-a-DCB-substrate-with-Al-ribbons-10-and-c-a-Cu.png)
a) Cu wire bonds on an IGBT [9], (b) a DCB substrate with Al ribbons... | Download Scientific Diagram
Cu Clip Bonding Method with Optimized Source Inductance for Current Balancing in Multichip SiC MOSFET Power Module
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Energies | Free Full-Text | Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging
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No-Clean Solder Paste for Clip-bonding Die-Attach | Dr. Andy Mackie | Indium Corporation Blogs | Die Attach | No Clean Solder | Voiding
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